October 10, 2024 [New Albany, IN]-- Samtec, Inc., the connector industry service leader, will demonstrate next-generation, high-performance optical and copper interconnect solutions at the upcoming OCP Global Summit, the premier event for the Open Compute Project Foundation (OCP) showcases cutting-edge advancements in open hardware and software. 

Held in San Jose, CA (October 15-17, 2024), the OCP Global Summit emphasizes a commitment to fostering innovation that moves beyond theoretical discussions and results in real-world solutions. Samtec works closely with its customers and partners to bring innovative interconnect solutions to market that meet specific real-world needs. For example, this year at the OCP Global Summit, Samtec will debut the FireFly^TM OCP OAI EXP Module, which features 16 FireFly optical transceivers with 1.6 Gbps aggregate throughput. The FireFly module is protocol agnostic, including support for Ethernet, PCIe, and CXL over optics. It typically requires half the power of MSA style optics, and a full OAI system design could accommodate up to 8 FireFly OAI EXP Module cards.

The FireFly OCP OAI EXP Module also incorporates enabling technology from US Conec, whose very small form factor (VSFF) MMC optical connectors allow Samtec to achieve the fiber density required for the OCP card form factor. US Conec’s DirectConec^TM push-pull boot technology provides effortless connector insertion and extraction in the densest environments.

“US Conec’s MMC technology brings unparalleled optical density to the FireFly OCP OAI EXP Module,” said Tom Mitcheltree, Advanced Technology Manager at US Conec. “With the integration of the MMC connector platform into Samtec’s FireFly high density connectivity solution, our collaboration will bring high-quality, innovative solutions to the datacenter market.”

In booth #A3, Samtec will be demonstrating high-speed, high-density interconnects that are well suited for use in datacenters, AI/high-performance computing, and telecom/edge applications up to 224 Gbps. In addition to the FireFly OCP OAI EXP Module with MMC connectivity, products and demonstrations featured include FireFly optical transceivers, the new Si-FLY® HD, Halo^TM next-gen 56 Gbps optical system for optical or copper interconnects, CXL over optics, and PCIe.

More Information

• Samtec’s optical products, visit samtec.com/optics
• Samtec’s products for 224 Gbps PAM4, visit Samtec.com/224
• US Conec MMC Connectors, visit mmc-brochure.pdf (usconec.com)

About Samtec, Inc.

Founded in 1976, Samtec is a privately held, $1 Billion dollar global manufacturer of a broad line of electronic interconnect solutions, including High-Speed Board-to-Board, High-Speed Cables, Mid-Board and Panel Optics, Precision RF, Flexible Stacking, and Micro/Rugged components and cables. Samtec Technology Centers are dedicated to developing and advancing technologies, strategies, and products to optimize both the performance and cost of a system from the bare die to an interface 100 meters away, and all interconnect points in between. With 40+ international locations and products sold in more than 125 different countries, Samtec’s global presence enables its unmatched customer service. For more information, please visit: http://www.samtec.com.

About OCP

The Open Compute Project (OCP) is a global collaborative Community of hyperscale data center operators, telecom, colocation providers and enterprise IT users, working with the product and solution vendor ecosystem to develop open innovations deployable from the cloud to the edge. The OCP Foundation is responsible for fostering and serving the OCP Community to meet the market and shape the future, taking hyperscale-led innovations to everyone. Meeting the market is accomplished through addressing challenging market obstacles with open specifications, designs and emerging market programs that showcase OCP-recognized IT equipment and data center facility best practices. Shaping the future includes investing in strategic initiatives and programs that prepare the IT ecosystem for major technology changes, such as AI & ML, optics, advanced cooling techniques, composable memory and silicon. OCP Community-developed open innovations strive to benefit all, optimized through the lens of impact, efficiency, scale and sustainability. Learn more at: www.opencompute.org.

About US Conec:

US Conec is a global leader in the design and development of high-density optical interconnects. With over thirty years of innovative experience, the company provides industry leading components for data center and enterprise structured cabling, public networks, on-board optical interconnects, industrial and military markets worldwide. Key product developments include MT ferrules, MTP® brand MPO connectors, MTP® PRO solutions, Fast-Track™ MTP® connectors, DirectConec™ push-pull boot technology, MXC® connectors, PRIZM® LightTurn® and PRIZM® MT lensed ferrule technologies, ELiMENT® single fiber connectors, very small form factor MDC and MMC connectors, IBC™ fiber-optic cleaning solutions, termination equipment, high precision optical packaging components, and customized precision interconnect solutions. US Conec is headquartered in Hickory, North Carolina, and is an equity venture of three leading communications technology companies—Corning, Inc., Fujikura, and NTT-AT. For more information, visit https://www.usconec.com.

Samtec, Inc.
P.O. Box 1147
New Albany, IN 47151-1147
USA
Phone: 1-800-SAMTEC-9 (800-726-8329)
www.samtec.com/media-room

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